Page 138 - MATERIAL SCIENCE AND ENGINEERING PART 1

Atomic bonding 1 2 3 4
3

Ionic bond Covalent bond Metallic bond

Properties of metallic

compound:

1. The valence electrons
are free to move in

“cloud of electrons”,

thus conduct heat and

electricity easily.
2. The delocalized sharing

of free electrons enable

the atoms to slide past

each other when the
metal is deformed

instead of fracturing like

glass or brittle materials.
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Politeknik Ibrahim Sultan